The processes on wafer (as silicon wafer, ceramic wafer, glass wafer and so on) metal and dielectric layer etch often are used in the fields of IC FAB, MEMS, LED and OPTO. For large scale production “auto clean and etch hood (MC-01AP-A8)” (http://www.szmst.com/en/yy.asp?menuid=114) is excellent. For R&D, small scale production and some special process the special professional equipments will be needed.

The equipments with series MME designed and made by MST are special for above applications. This series of equipments will make up of a complete series together with MST’s MDSE series, MEC series, MWPSS series and MHFF series for wafer etch and clean.

The details on the equipments and processes:

Process Types
Metal etch	Au，Ti, TiW, Cu，Ni，Cr，AL and others.
Lift-off	Lift-off process.
Dielectric layer etch	Si, Poly-Si，SiO2, LTO, PSG, Si3N4.
Deep silicon etch	KOH or TMHA Si etch for V groove and cavity.
Wet PSS etch	Etching sapphire substrate in LED
Porous silicon etch	Electrochemical etch to get porous silicon film
HF vapor etch	HF vapor etching SiO2
Equipment Series
Equipment	Process	Web Link
MME   series	Metal etch Lift-off Dielectric layer etch	http://www.szmst.com/cn/products.asp?menuid=123
MDSE  series	Deep silicon etch	http://www.szmst.com/cn/yy.asp?menuid=131
MEC   series	Porous silicon etch	http://www.szmst.com/cn/yy.asp?menuid=125
MWPSS series	Wet PSS etch	http://www.szmst.com/cn/yy.asp?menuid=130
MHFF  series	HF vapor etch	http://www.szmst.com/cn/yy.asp?menuid=113