The porous silicon etch is that silicon wafer is etched in HF solution via electrochemical method for getting the porous silicon film. The porous silicon film is a material with large surface and more holes, applied in more fields as device isolation, light-induced generation, electroluminescent, and Opto and so on.

   The porosity and aperture are two typical features of the porous silicon material, which can be controlled via process parameters.

   The porous silicon etcher with MEC series designed and made by MST is special for above applications. The equipments with reliable and safe can control all of process parameters to get the porous silicon film with high quality. The equipments include two types of experimental and productive to meet different users.

   The features of the equipments are as below.

  1. Main materials: ROCHLING white PP

  2. Tank materials: ROCHLING NPP

  3. Cathode: made from Pt, Mo, Graphite with holes and special connecting kit.

  4. Anode: made from Pt, Mo, Graphite special connecting kit.

  5. Power source: DC or pulse

  6. Light AUX: lighting system and special design of cathode.

  7. Circulation: adjustable flow and PP filter.

  8. Heating: PTFE heater, controlled temp max 70℃.

  9. Tooling: electrical connection between wafer and power for the wafers with or without backmetal.

   The details for equipments and process: http://www.szmst.com/en/tech.asp?menuid=156

    Experimental type: " porous silicon etcher(MEC-01AR).pdf"

    Productive type: " porous silicon etcher(MEC-01AP).pdf"