Auto wafer clean and etch hood with designed and made by MST is special for IC large-scale production in semiconductor. It is applied in the processes of wafer cleaning and etching.
The series of equipment is with structure of semi-seal cabinet and main material of ROCHLING white PP. The integrated control system for equipments is PLC touch screen with internal program MST-MC-CONTROL which control servo three-dimensional robots to run the equipments and operate the processes automatically. Its capacity is 8 inch(or less) Si wafer 50cs/run with auto wafer dry system.
The specifications and features are the below.
1. Wafer size: 8 inch (or less) wafer
2. Capacity: 50pcs/run, double cassette.
3. Equipment structure: semi-seal cabinet.
4. Main material: ROCHLING white PP
5. Run mode: auto mode; option: semi-auto mode or manual mode.
6. Control mode: PLC touch screen with internal program MST-MC-CONTROL
7. Operation mode: servo three-dimensional robot system.
8. Anti-etch: as semiconductor standards.
9. DI water pipe: PVC special for DI water.
10. N2 pipe: PTFE
11. DI water and N2 gun: semiconductor standard parts.
12. The types of tanks installed in the equipments.
- Quartz tanks: max 200℃,+/-1.0℃; level alarm; drain.
- PVDF tanks: max 90℃,+/-1.0℃; circulation, level alarm; drain.
- NPP tanks: max 90℃,+/-1.0℃; circulation, level alarm; drain.
- Ultrasonic tanks: heating, circulation, drain, internal tanks from different materials as quartz, PVDF, NPP.
- QDR: standard QDR unit.
- Wafer dry: three PVDF tanks for IPA and thermal N2.
" auto wafer clean and etch hood(MC-01AP-A8).pdf"
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