The electroplating with non-cyanide for wafer is an important process and more applications in the fields of Semiconductor, MEMS, LED and Advanced package as its environmental advantages.

The micro-electroplating equipments made by MST are special for non-cyanide process with two types of R&D and productive, which can meet the different users. The micro-electroplating processes with gold, silver, copper, nickel, tin and so on are widely applied in the follow fields.

1	Semiconductor	the bump with gold, silver, solder.
2	MEMS	LIGA process; sacrificial layer with copper, structure layer, cantilever, low stress metal film, connect line, bump and electrode with gold, nickel
3	Advanced package	AuSn and CuSn solder, bump， connect line, electrode, solder ring, via hole, and so on.
4	LED	gold bump, heat dissipation substrate
5	Others	micro-size function metal film

The details for equipments and process: http://www.szmst.com/en/tech.asp?menuid=156

Experimental type: "wafer microelectroplating hood(MP-01AR).pdf"

Productive type: "wafer microelectroplating hood(MP-01AP).pdf"